Screen Printing

Panasonic’s high-speed screen printing machines are the ultimate solution for lean SMT manufacturing. The original uni-floating printing method reliably delivers the right amount of solder in the right form with high-speed snap-off and reduced solder waste.

Products

Screen Printing

Panasonic SPG Screen Printer

Features

Excellent cost performance
High productivity
Stable quality
New type of cleaning unit
Solder paste auto feeding cutrunning costs

The system prints the PCB with solder paste through a stencil. This is done fully automatically with the Panasonic systems. The automatic solder paste feed controls the solder volume on the stencil by means of a line sensor, which enables continuous printing and stable quality over a long period of time. Panasonic is one of the leading and largest electronics manufacturers in the world! It offers highly reliable electronics manufacturing systems for the production of electronic assemblies. The high-quality equipment features the world's latest technologies. Excellent price-performance ratio and at the same time high productivity and consistent quality.

Download the brochure now!

Panasonic SP70 Screen Printer

Features

Higher quality & higher productivity . . Further pursuing of high quality printing with “the cornerstone of quality is printing”
Easy operation . . Further pursuit for changeovers with higer speed
A wide range of applications

Download the brochure now!

Panasonic SPD Screen Printer

Features

Dual printing stage that furthers productivity
Higher quality & higher productivity . . Further pursuing of high quality printing with “the cornerstone of quality is printing”
A variety of options that increase quality and productivity

Download the brochure now!

Increased performance

The three-part or three-segment high-speed transport system is certainly one of the highlights of the paste printer. There is one PCB on the feed belt, one on the print table and another on the output belt. This buffer, combined with fast loading and unloading, guarantees a cycle time saving of around 2 seconds compared to conventional systems.

An increase in performance that is in no way inferior to the extremely fast cleaning system. In addition to the option of carrying out a cleaning process wet, dry or with a vacuum, the special feature is that cleaning can already begin during the PCB loading cycle. This avoids unnecessary loss of time. This extremely fast loading and cleaning time makes it possible to clean after every print. Cleaning per print process brings great advantages, especially for the smallest print structures, as the printing process is stabilized and process reliability is increased. The result is a significant reduction in the number of errors.

Thanks to a precision winding mechanism, the consumption of cleaning paper per cleaning cycle is reduced to just 6 mm. Very ecological.

Another feature that increases performance is the hybrid print head with fast, motor-driven up and down movement of the doctor blade. The pneumatic doctor blade system ensures smooth printing. The print head contains a closed control loop for the pneumatic printing force, which is overlaid with a sensor. This measures if there is a sharp increase in the printing force in order to stop the machine immediately and thus protect the squeegee and stencil from damage.

Produce quality

The paste printer also stands out in terms of quality. In addition to the closed control loop for printing force, the system offers everything the electronics manufacturer needs for high-quality solder paste printing. The servo-driven printing table has a freely programmable multi-level jumping system and automatic parameterization of the printing process. Two functions that are crucial for the company's high quality standards. In this case, the thixotopy of the solder paste is used to reduce the viscosity of the paste in the stencil with a high-speed movement. This enables very gentle release of the solder deposits from the stencil. The various jumping functions of the movement in turn guarantee that the optimum characteristics are always used for the respective paste. In addition to various release characteristics, a constant release mechanism can of course also be freely programmed. All commercially available solder pastes and more can be processed without any problems. The negative jumping function compensates for a lack of mask tension in the case of thin or worn masks, thus eliminating the possibility of errors.
To further ensure continuous process stability, closed-loop concepts such as inspection function with X/Y/theta correction, cleaning signal or double print triggering ensure the elimination of print misalignment. The paste printer is also able to communicate with external SPI systems from leading manufacturers via a 3D SPI interface. Alternatively, it uses the integrated inspection function. The result is always the same: an increase in print quality.

Another outstanding feature is the automatic print table adjustment using a height sensor and the vacuum fixing of the stencil during the printing process. This prevents stencil misalignment and reduces bouncing of the stencil on take-off. A PCB edge support allows thin and sensitive PCBs to be printed, thus completing the Panasonic quality standard.

User-friendly and continuous production

The user-friendliness claimed for the SPG stencil printer certainly has its raison d'être. The touchscreen user interface is easy to learn and password-protected at different levels. This makes it possible to define exactly which activities are permitted for whom in order to prevent misuse or incorrect operation. Automatic generation of print parameters depending on the application and requirements ensures the optimum process. If necessary, these print parameters can be adjusted accordingly. The menu-guided product change guides the operator through each step, which must always be confirmed in order to continue.

Another user-friendly feature is the sensor on the printing table, more precisely on the X-axis of the solder paste feed. It measures whether the stencil is in the correct position when adjusting the table height. If it is sagging, for example, the print position is corrected after the values have been confirmed. The solder paste is applied directly from the pot. The printer uses a sensor to detect the amount of paste remaining on the stencil and then applies the required amount of paste. This saves additional costs for the cartridges required and at the same time enables uninterrupted production.

The diverse standard features and options of the paste printer make it an all-rounder in almost all application environments.Whether in the Super Finepitch area or the latest components 00603 through to production in the standard industrial electronics area, the system is configured so that it can be used anywhere.From the basic system, which already has everything for quality, efficiency and speed, to the high-end system for demanding processes.